|Applicants:||3M INNOVATIVE PROPERTIES COMPANY [US/US]; 3M Center Post Office Box 33427 Saint Paul, Minnesota 55133-3427 (US)|
|Inventors:||BARDTS, Mareike; (DE)|
|Agent:||SOO, Philip P.; (US).
BLANK, Colene H.,; (US).
FLORCZAK, Yen Tong,; (US).
HARTS, Dean M.,; (US).
LEVINSON, Eric D.; (US).
MAKI, Eloise J.,; (US).
NOWAK, Sandra K.,; (US).
OLSON, Peter L.,; (US).
RHODES, Kevin H.; (US).
RINGSRED, Ted K.,; (US)
|Title||(EN) RAPID CURING AND HIGH THIXOTROPY EPOXY ADHESIVE COMPOSTIONS
(FR) DURCISSEMENT RAPIDE ET COMPOSITIONS ADHÉSIVES ÉPOXY DE THIXOTROPIE ÉLEVÉE
(EN)The present disclosure is directed to a precursor composition for a curable adhesive, the precursor comprising: a) a part (A) comprising: i. a first epoxy curing agent comprising at least one polyether amine and having an amine equivalent weight of at least 45 grams per mole of amine equivalents; ii. a second epoxy curing agent distinct from the first epoxy curing agent; iii. a metal nitrate catalyst; iv. optionally, a metal triflate catalyst; and b) a part (B) comprising: i. an epoxy resin; ii. a filler material; iii. an epoxy-based reactive diluent; and iv. optionally, a core-shell polymer toughening agent; and wherein the amount of filler material is selected such as to provide the part (B) with a hysteresis area of at least 30 Pa x 1/s, when measured at 23C according to the test method described in the experimental section. The compositions of the present disclosure are particularly suitable for use in structural bonding applications, in particular for adhesively bonding small parts in manufacturing operations in aeronautic and aerospace industries. The present disclosure also relates to method of using such epoxy resin based curable compositions.